Events

OCP APAC Summit 2026

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KAORI Heat Treatment Co., Ltd. is honored to announce our participation in the 2026 OCP APAC Summit, held from August 11 to 12 at the Taipei Nangang Exhibition Center, Hall 2 (TaiNEX 2)!

As the most influential open data center technology event in the APAC region, this year's summit will center on cutting-edge hardware innovations, including AI Clusters and Cooling Environments.

At the event, our team of professionals will deliver a technical presentation. We cordially invite you to join our session:

Topic: Enabling High-Density Data Center Cooling: The Critical Role of Brazed Plate Heat Exchangers
Speaker: R & D Manager, Mike Lu
Time: Wednesday, August 12, 11:00 – 11:15
Location: 7th Floor, Room 701F (BS2)

During this session, we will share deep insights on how our next-generation plate heat exchanger (PHE) technology effectively optimizes thermal management for high-density AI servers and data centers, successfully reducing PUE while fulfilling our commitment to green and sustainable energy.

Following our presentation, we cordially invite you to visit our Plus Booth (PL17). Our on-site technical experts and sales representatives will showcase our latest liquid cooling solutions and provide one-on-one professional consultations tailored to your specific system architecture.

Exhibition Details: